THICK FILM CAPABILITIES

  • ARTWORK GENERATION & SCREEN FABRICATION
  • C02 LASER SCRIBING & MACHINING
  • DIAMOND SAWING 
  • LASER & AIR ABRASIVE TRIMMING
  • METALLIZED HOLES, SLOTS, WRAPAROUNDS
  • CROSSOVERS
  • DOUBLE-SIDED DESIGNS
  • Ni, SnPb, Au ELECTROPLATING
  • COMPONENT MOUNTING
  • ENCAPSULATION, MARKING
  • HIGH RELIABILITY SCREENING

  • THICK FILM MATERIALS

    SUBSTRATE TYPES
    ALUMINA CERAMIC (96% Al2O3):
    10, 12, 15, 20, 25, 40 mils thick standard
    Sizes to 4 x 4 inches

    RESISTORS
    1ohm/Square to 10Mohm/Square
    TCRs to 100 PPM
    Tolerances to 0.5%

    CONDUCTORS
    SILVER
    PLATINUM/SILVER
    PALLADIUM/SILVER
    GOLD
    PLATINUM/GOLD


    DIELECTRICS
    Crossover Dielectrics
    Glass Overglazes
    Polymer Overcoats



    THIN FILM CAPABILITIES

  • ARTWORK GENERATION
  • CHEMICAL / PLASMA ETCHING
  • DC/RF SPUTTERING
  • DIAMOND SAWING
  • YAG LASER TRIMMING
  • METALLIZED HOLES
  • DOUBLE-SIDED DESIGNS
  • MULTILAYER CIRCUTS
  • ENCAPSULATION, MARKING
  • HIGH RELIABILITY SCREENING
  • THIN FILM MATERIALS

    SUBSTRATE TYPES
    ALUMINA CERAMIC (99.6% Al2O3):
    10, 15, 25 mils thick standard
    As-fired & polished
    Surface finish < 1 microinch
    Sizes to 4 x 4 inches

    SILICON:
    10, 18 mils thick
    3 inch diameter, standard
    10,000 angstroms oxide layer
    Ultra fine line etching (2.5 microns)

    BERYLLIUM OXIDE (99.5% BeO):
    10, 15, 25 mils thick
    Surface finish < 5 microinches
    Sizes up to 4 x 4 inches
       (standard 2 x 2 inches)


    RESISTORS

    TANTALUM NITRIDE (20ohm/sq - 200ohm/sq)
    NICHROME (20ohm/sq - 200ohm/sq)
    LASRER TRIMMING TO 0.1% TOLERANCE
    RATIO MATCHING TO 0.05%
    TCRs TO 25PPM
    TCR TRACKING TO 2 PPM


    CONDUCTORS
    GOLD
    PALLADIUM
    TITANIUM/TUNGSTEN
    NICKLE
    ALUMINUM

    DIELECTRICS
    POLYIMIDE & EPOXY OVERCOATS

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