Resources | Lot Acceptance Criteria
Test Criteria
Pass/fail criteria for our standard and high reliability thick and thin resistors as well as our MIL-PRF-55342 qualified chip resistors are listed in the table below. The criteria for the MIL-PRF-55342 product are based upon the resistance temperature characteristic. Temperature characteristics K and M are typically produced using thick film technology, while temperature characteristics E and H can only be produced using thin film technology. The pass/fail criteria for our standard grade thick and thin film products mimic those stated in MIL-PRF-55342.
| MIL-PRF-55342 |
STANDARD |
||||||
|---|---|---|---|---|---|---|---|
| Test Conditions | E | H | K | L | M | Thin Film | Thick Film |
| Resistance Range | 5.6Ω-1MΩ | 5.6Ω-1MΩ | 1Ω-1MΩ | 1Ω-1MΩ | 1Ω-22MΩ | 5Ω-5.6MΩ | 0Ω-100MΩ |
| TCR (-55 to +125°C) in ppm/°C | ±25 | ±50 | ±100 | ±200 | ±300 | to±25 | to±100 |
| Max. Ambient Temperature, Full Power | 70°C | 70°C | 70°C | 70°C | 70°C | 70°C | 70°C |
| Max. Temperature, Zero Wattage | 150°C | 150°C | 150°C | 150°C | 150°C | 150°C | 150°C |
| Thermal Shock (max % change)* | ±0.1 | ±0.25 | ±0.5 | ±0.5 | ±0.5 | ±0.1 | ±0.5 |
| Low Temp. Operation (max % change)* | ±0.1 | ±0.25 | ±0.25 | ±0.25 | ±0.5 | ±0.1 | ±0.25 |
| Short-time Overload (max % change)* | ±0.1 | ±0.1 | ±0.25 | ±0.25 | ±0.5 | ±0.1 | ±0.25 |
| Resistance to Soldering Heat (max % change)* | ±0.2 | ±0.25 | ±0.25 | ±0.25 | ±0.25 | ±0.2 | ±0.25 |
| Moisture Resistance (max % change)* | ±0.2 | ±0.4 | ±0.5 | ±0.5 | ±0.5 | ±0.2 | ±0.5 |
| Life (max % change)* | ±2.0 | ±2.0 | ±2.0 | ±2.0 | ±2.0 | ±2.0 | ±2.0 |
| High Temperature Exposure (max % change)* | ±0.1 | ±0.2 | ±0.5 | ±0.5 | ±1.0 | ±0.1 | ±0.5 |